CPC-1500C |
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1U Intel Socket-G2 PGA988 Core i3 / i5 / i7 Mobile CPU Cooler
» Support Intel Socket G2 PGA988 Core i3 / i5 / i7 Mobile Processors
» Suitable for Intel Sandy Bridge / Ivy Bridge mobile platform up to 45W TDP
» Meets 1U Systems Configuration with 26.50mm of Height with Fan
» Copper-based Skive Heat Sink with Long-Life Dual Ball Bearing Fan
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- Support Intel Socket G2 PGA988 Core i3 / i5 / i7 Mobile Processors.
- Suitable for Intel Sandy Bridge / Ivy Bridge mobile platform with Socket G2 µPGA988 / FCPGA988 / rPGA988B.
- 0.58°C/W of Thermal Resistance with 50x50x10mm 5000 rpm Fan with 10.8 CFM.
- Meets 1U Systems Configuration with 25.90mm of Height with Fan.
- Copper-based Heat Sink with High-Density Skive Fins.
- Powerful 50mm / Long-Life Dual Ball Bearing Cooling Fan.
- Meet 1U Height System Configuration
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Liantec CPC-1500C Intel Socket-G PGA988 Sandy Bridge / Ivy Bridge Mobile 1U Copper-based CPU Cooler
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CPC-1500C Sample Enquiry
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|| Overview
| Feature
| Specification
| Thermal Resistance / Noise
| Mechanical Drawing ||
|| Ordering Code
| Product Image
| Datasheet (PDF) ||
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Overview |
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Liantec CPC-1500C series is an industrial 1U copper-based CPU cooler for Intel Socket G2 µPGA988 /
FCPGA988 / rPGA988B Sandy Bridge / Ivy Bridge mobile processors. |
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Key Features |
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Liantec CPC-1500C series is an industrial 1U copper-based CPU cooler for Intel Socket G2 µPGA988 /
FCPGA988 / rPGA988B Sandy Bridge / Ivy Bridge mobile processors.
- Support Intel Socket G2 PGA988 Core i3 / i5 / i7 Mobile Processors.
- Suitable for Intel Sandy Bridge / Ivy Bridge mobile platform with Socket G2 µPGA988 / FCPGA988 / rPGA988B.
- 0.58°C/W of Thermal Resistance with 50x50x10mm 5000 rpm Fan with 10.8 CFM.
- Meets 1U Systems Configuration with 25.90mm of Height with Fan.
- Copper-based Heat Sink with High-Density Skive Fins.
- Powerful 50mm / Long-Life Dual Ball Bearing Cooling Fan.
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Specification |
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Form Factor |
Industrial 1U CPU Cooler |
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CPU Platform |
Intel Socket G / G2 PGA988 (FCPGA988, rPGA988B) Core i3 / Core i5 / Core i7 / Celeron Mobile Processors
Supports up to 45W of TDP |
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Chassis |
1U and above of chassis height |
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Dimension |
60 x 60 x 26.5 mm (overall dimension including fan) |
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Heat Sink |
- Material : Copper 1100.
- Technology : Skive.
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Mounting Pitch |
51.0 x 51.0 mm |
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Cooling Fan |
- Fan Dimension : 50 x 50 x 10 mm
- Bearing System : 2 balls
- Rated Speed : 5000±10% RPM
- Rated Power Input : +12V DC
- Rated Power Consumption : 2.8 watts
- Acoustical Noise : 31.8 dBA
- Lead Wire Pin Out :
- Pin1-Black (-, power return, ground)
- Pin2-Red (+, power iinput, +12V dc)
- Pin3-White (Tachometer/Signal output)
- MTBF over 50,000 hrs under 25°C or 77°F
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Thermal Pad |
Honeywell PCM45F thermal pad |
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Weight |
199±5 g |
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Ordering Code |
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Ordering Code |
Description |
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CPC-1500C |
Industrial 1U Copper Intel Socket G/G2 PGA988 CPU Cooler
Support Intel Sandy Bridge Core i3 / i5 / i7 Mobile Processors
with Copper-based Skrive Heat Sink, Dual Ball Bearing Cooing Fan |
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